Nuvo-5000LP
Intel® 6th-Gen Core™ i7/i5/i3 fanless rugged embedded computer with 6x GbE, MezIO™ interface & low-profile chassis
- Intel® 6th Gen Core™ i7/i5/i3 35W/65W socket-type CPU
- MezIO™ interface for easy function expansion
- Rugged, wide temperature range from -25°C to 70°C fanless operation
- Up to 6x GigE ports, supporting 9.5 KB jumbo frame
- Up to 32 GB, DDR4-2133 SODIMM
- One hot-swappable 2.5” HDD/SSD and one fixed 2.5” HDD/SSD, supporting RAID 0/1
- Accommodates two 2.5" SATA HDD/SSD with RAID 0/1
- VGA/DVI/DP triple independent display, supporting 4K2K
- 77 mm low-profile design
Overview
Introduction
Nuvo-5002LP/5006LP is the low-profile version of Nuvo-5000 family. It features a low-profile chassis, which reduces its height to 77 mm, and remains extraordinary 25°C to 70°C operating temperature. For those demanding varied computing power, Nuvo-5002LP/5006LP supports socket-type CPU for flexible CPU installation. You can choose Intel® 6th Gen Core™ i7/i5/i3, from 35W to 65W TDP, according to your performance consideration and operating environment.
Nuvo-5002LP/5006LP fanless embedded computer inherits comprehensive I/O functions, such as GbE, USB 3.1 Gen1/ USB 2.0, COM and VGA/DVI/DP, from Nuvo-5000E/P. It also incorporates Neousys' MezIO™ interface for further I/O expansion. By installing optional MezIO™ module, Nuvo-5002LP/5006LP turns immediately from a typical embedded controller to a ruggedized application platform including 11x COM ports, 32 DIO channels, ignition power control, or your customized application-specific I/O.
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Specification
| System Core | |
|---|---|
| Processor | Core™ i7-6700 (8M Cache, 3.4/4.0 GHz, 65W TDP)* Core™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP)* Core™ i3-6100 (3M Cache, 3.7 GHz, 51W TDP)* Pentium® G4400 (3M Cache, 2.4 GHz, 54W TDP)* Celeron® G3900 (2M Cache, 2.8 GHz, 51TDP)* Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP) Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP) Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP) Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP) Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP) |
| Chipset | Intel® Q170 Platform Controller Hub |
| Graphics | Integrated Intel® HD Graphics 530 (Core™ i7/i5/i3) Integrated Intel® HD Graphics 510 (Pentium®) |
| Memory | Up to 32GB DDR4-2133 SDRAM (two SO-DIMM slots) |
| AMT | Supports Intel® AMT 11.0 |
| TPM | Supports TPM 2.0 |
| I/O Interface | |
|---|---|
| Ethernet | 2x Gigabit Ethernet ports by Intel® I219 and I210 (Nuvo-5002L/P) 6x Gigabit Ethernet ports by Intel® I219 and 5x I210 (Nuvo-5006L/P) |
| PoE+ | Optional IEEE 802.3at PoE+ PSE for GbE Port 3 - 6, 80 W total power budget |
| USB | 4x USB 3.1 Gen1 ports via native XHCI controller 4x USB 2.0 ports |
| Video Port | 1x stacked VGA + DVI-D connector 2x DisplayPort connectors, supporting 4K2K resolution (triple-independent display support) |
| Serial Port | Port 2x software-programmable RS-232/422/485 port (COM1 & COM3) 1x RS-232 port (COM2) |
| Audio | 1x Mic-in and 1x Speaker-out |
| Storage Interface | |
|---|---|
| SATA Interface | 1x hot-swappable tray for 2.5" HDD/SSD installation 1x Internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/1 |
| mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
| Expansion Bus | |
|---|---|
| Mini PCI-E | 1x internal mini PCI Express socket with front-accessible SIM socket 1x internal mini PCI Express socket with internal SIM socket (mux. with mSATA) |
| Expandable I/O | 1x MezIO™ expansion port for Neousys MezIO™ modules |
| Power Supply | |
|---|---|
| DC Input | 1x 3-pin pluggable terminal block for 8V to 35V DC input |
| Remote Ctrl. & Status Output |
1x 10-pin (2x5) wafer connector for remote on/off control and status LED output |
| Mechanical | |
| Dimension | 240 mm (W) x 225 mm (D) x 77 mm (H) |
| Weight | 3.1 Kg (including 2.5" HDD and DDR4 SODIMM) |
| Mounting | Wall-mounting (standard) or DIN-Rail mounting (optional) |
| Environmental | |
|---|---|
| Operating Temperature | with i7-6700TE, i5-6500TE, i3-6100TE, Pentium G4400TE (35W TDP) -25°C ~ 70°C ** with i7-6700, i5-6500, i3-6100 (65W/51W TDP) -25°C ~ 70°C */** (configured as 35W mode) -25°C ~ 50°C */** (configured as 65W/51W mode) |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 10%~90% , non-condensing |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) |
| EMC | CE/FCC Class A, according to EN 55022, EN 55024 & EN 55032 |
Date last revised: Jul. 12, 2018
* For i7-6700 running at 65W mode, the high operating temperature shall be limited to 50°C and thermal throttling may occur when sustained full-loading applied. Users can configure CPU power in BIOS to obtain higher operating temperature.** For sub-zero operating temperature, a wide temperature range HDD drive or Solid State Disk (SSD) is required.
Power Backup Modules:
 |
|
 |
| PB-9250J-SA 9250 w.s Standalone Intelligent SuperCAP Power Backup Module |
PB-4600J-SA 4600 w.s Standalone Intelligent SuperCAP Power Backup Module |
PB-2580J-SA 2580 w.s Standalone Intelligent SuperCAP Power Backup Module |
Ordering Information
Nuvo-5002LP
Intel® 6th-Gen Core™ low-profile fanless embedded computer with 2x GbE and MezIO™
Nuvo-5006LP
Intel® 6th-Gen Core™ low-profile fanless embedded computer with 6x GbE and MezIO™
Optional 802.3at PoE+ for GbE ports 3 ~ 6
Supported MezIO™ Modules
Neousys MezIO™ module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.
(Click here for details of compatible MezIO™ modules)
Accessory/Option
DINRAIL-O
DIN-rail mounting assembly for Nuvo-5000LP series
PA-120W-OW
120W AC/DC power adapter 20V/6A; 18AWG/120cm; cord end terminals for terminal block, operating temperature : -30 to 70 °C
